摘要本文针对微推进器阵列点火层与药室层的封装问题，介绍了一种低温共晶键合的方法，并探究了低温共晶键合的工艺参数，成功实现了药室层与喷口层的键合，测得了其剪切力数据。建立了微推进器阵列单元的燃烧传热模型，并使用ANSYS软件对点火后药室的热性能进行了分析。
分别以覆铜板、镀上铜膜的硅片为研究对象，研究了低温键合工艺条件。实验结果表明合金生长质量直接影响低温共晶键合的成败。在合金生长影响因素中pH值和铜膜厚度影响较大，湿润时间、水浴温度影响不大。具体为：合金生长适宜的pH值为0--0.5之间；铜膜的厚度对小尺寸合金的生长影响很大，为保证合金生长成所需要的图案，一般铜膜厚度为500nm--1000nm；湿润时间和水浴温度可以根据需要调整。
采用实验获得的最佳工艺参数完成了药室层与喷口层的键合，并测试了键合剪切强度。结果表明，药室的不同区域，单位面积上的剪切力强度区别很大，药室边缘处达到4.061N/mm2,而在药室中间处仅为1.196 N/mm2。
建立了微推进器阵列的单元燃烧传热模型并通过有限元分析点火后单元药室的温度分布，数值模拟的结果表明硅材料不适合作为药室材料；用7740Pyrex玻璃与环氧树脂作为药室材料不会引起相邻药室单元的发火。
关键词  微推进器  低温共晶  微尺度传热  剪切强度  ANSYS热分析
毕业设计说明书（毕业论文）外文摘要
Title  Low-temperature bonding method for micro-thruster                                                  
         array and analysis of microscale heat transfer process
Abstract
To deal with the combustion chamber and the nozzle chamber packaging problem of the micro-thruster array, a low-temperature eutectic bonding method was presented. The specific bonding process parameters were explored. The combustion chamber and the nozzle chamber bonded together by applying the optimal parameters and the shear stress was tested. A model describing the process of combustion and heat transfer of micro-thruster array was established and the thermal properties of the combustion chambers were simulated by ANSYS software.
By taking the CCL and the silicon wafer with copper film platted as research object, the bonding process parameters of the low-temperature bonding method were studied. The experimental results showed that the quality of the growth alloy directly affected the success of low temperature eutectic bonding process. The pH value and thickness of the copper film had a great influence on the growth of the alloy ,while the wetting time and the bath temperature didn’t make much difference to it. The results were showed as follows ：a suitable pH value for the growth of the alloy was 0--0.5; the thickness of the copper film had a great influence on the small size alloy and a suitable thickness of the copper film was 500nm or 1000nm in order to get a needed pattern; the wetting time and the bath temperature  were variable according to practical experiments.
The combustion chamber and the nozzle chamber were bonded together successful by applying the optimal parameters and the shear stress were tested. The results showed that the shear strength per unit area was greatly difference in different regions of the chamber. The value of which in the edge of the chamber was 4.061N/mm2, while in the middle of the chamber was 1.196N/mm2.
A model describing the process of combustion and heat transfer of micro-thruster array was established and the temperature distributions of the combustion chambers were simulated by ANSYS software. The results show that silicion was not suitable as combustion chamber materials and the ignition in a chamber didn’t affect other adjacent chambers when epoxy resin and 7740-type glass were chosen to be the material of the combustion chamber. ANSYS微推进器阵列低温键合方法及微尺度传热过程初探:http://www.751com.cn/huaxue/lunwen_17100.html