摘要本论文采用氢气泡模板法，用硫酸铜和硫酸的混合溶液作为电解液，以副反应中产生的氢气泡为模板，通过控制电流密度、电沉积时间和添加剂的加入量，制备得到多孔铜薄膜，采用扫描电镜（SEM）和激光共聚焦显微镜（LSCM）对多孔铜的表面孔径、内部结构和三文形貌进行观察，发现多孔铜具有海绵状结构，孔壁有不同尺寸的晶枝支撑，这使多孔铜具有较高的比表面积和孔隙率。 实验过程中通过加入不同种类和浓度的添加剂，制备得到不同三文结构形貌的多孔铜9515
对于制备出的多种不同添加剂下的多孔铜薄膜，运用DSC、TG等热分析手段结合物相分析手段X-射线衍射（XRD）进行研究，结果表明，不同的添加剂对应的多孔铜微观特征有很大的不同。
含能氧化剂（高氯酸铵、硝酸钾、硝酸钠）的饱和溶液滴加到多孔铜的表面，当溶剂挥发后，制备得到多孔铜复合含能材料。运用SEM和激光共聚焦显微镜对填充前后的多孔铜形貌对比观察。
关键词  多孔铜薄膜，添加剂，热分析
毕业设计说明书（论文）外文摘要
Title  Thermal Study on the composite of porous
copper  film                             
Abstract
In this article, porous copper has been electrodeposited on the hydrogen bubble template which is produced by the side reaction in the Electrolyte solution. The bath Electrolyte is prepared with copper sulfate and sulfuric acid. Under the concrol of cathode current density, deposition time and the amount of additives, porous copper with different 3D morphology can be made.SEM and laser con-focal microscope were used to analysis the structure and morphology of porous copper film. It shows that there exists many small holes with different size under the surface of the copper film, and the sponge-like wall of porous copper is made up of small copper dendrites. It results in the ratio of surface area and porosity of the foamed copper film.
For a variety of different additive of preparation of porous film under copper ，By DSC and TG thermal analysis method combined phase analysis method XRD for research ，The results show that，Different additives corresponding porous bronze micro characteristics are quite different.
The saturated Acetone solution of Ammonium Per chlorate (NH4ClO4) is dropped to the surface of porous copper film by Trace sample injector. The composite material of NH4ClO4 and copper is made after the Acetone solvent is volatilized .Using SEM and LSCM ,the  observation of the composite material shows that the copper film become much denser.
Keywords   porous copper film   additives   Thermal analysis
目   次
1绪论    1
1.1多孔金属现况    1
1.2多孔铜制备方法    1
1.2.1去合金化法    1
1.2.2粉末冶金法    2
1.2.3模板法    2
1.3多孔铜的应用    5
1.4本论文的主要研究内容    5
2多孔铜薄膜的制备与表征    6
2.1实验原理    6
2.2实验装置    6
2.3实验步骤    7
2.3.1 铜片的清洗    7
2.3.2 氢气泡模板法电沉积制备多孔铜薄膜    8
2.3.3 实验的结果及处理    8
2.4多孔铜薄膜的表征方法    8
2.4.1 热重/差热同步分析仪    8
2.4.2 激光共聚焦显微镜    9
2.4.3 扫描电子显微镜（SEM）    9
2.4.4 X射线衍射仪(XRD)    10 多孔铜复合含能材料的制备与热分析:http://www.751com.cn/huaxue/lunwen_8265.html