摘要：MEMS 压力传感器是根据硅的压阻效应制成的。压力传感器的缺点之一就是具有很强的温度敏感性，温度会对其输出信号产生重大影响。导致压力传感器失真。本文的研究任务是对MEMS 中某硅进行热力学耦合分析进而进行优化设计。通过proe 软件建立传感器的四分之一模型，然后用 ANSYS workbench 建立有限元模型，进行热力耦合分析，通过改变硅膜片的温度载荷，研究温度变化是如何影响传感器输出信号的。考虑到传感器玻璃层厚度可能也会对输出信号的失真程度产生影响，本文改变了玻璃层的厚度，对比了不同玻璃层传感器输出信号的失真程度。同时，基板的材料也会对信号失真程度产生影响，本文也试图改变基板的材料，进而研究哪种材料更加适合作为传感器的基板材料。通过以上研究分析，本文为MEMS 中压力传感器的优化设计提出了宝贵的意见。
毕业论文关键词：ansys  workbench 有限元  MEMS  硅膜片  优化分析  热力耦合28694
Title   Thermo mechanical analysis and optimal design of a silicon diaphragm in MEMS Optimization analysis                               
Abstract
The MEMS pressure sensor is made from the effect of the silicon pressure.. One of the disadvantages of pressure sensor is that it has a strong temperature sensitivity, and the temperature can have a significant impact on the output signal.. Lead to pressure sensor distortion. The research task of this paper is to optimize the design of a silicon in a MEMS.. Through the proe software to establish a sensor of a quarter model and using ANSYS Workbench established finite element model, thermal coupling analysis, by changing the temperature loads of the silicon diaphragm, the study of temperature change is how to affect the output signal of the sensor. Taking into account the sensor glass layer thickness may also the output signal distortion effects, by changing the thickness of the layer of glass, compared the different glass layer of the sensor output signal distortion. At the same time, the material of the substrate can also affect the distortion of the signal, and this paper also tries to change the material of the substrate, and then study which material is more suitable as the substrate material of the sensor. Through the above analysis, this paper puts forward valuable suggestions for the optimization design of the pressure sensor in MEMS.
Keywords： ANSYS  workbench  MEMS  finite element thermal analysis  Optimization analysis  Thermal coupling
目录
第一章 绪论    1
I.    MEMS简介    1
MEMS制造的材料    1
理查德费曼MEMS制造技术    2
应用程序    3
mems产业结构    4
II.    压阻效应简介    4
压阻效应的机制    4
压敏电阻硅设备    5
III.    压阻传感器的优劣    5
IV.    本论文的主要研究内容    5
论文任务    6
第二章 MEMS压力传感器工作原理    7
压力传感器的输出信号【9】    7
在装配过程中，压力传感器的热行为【11】    7
第三章 硅膜片的有限元分析    10
I.    ansys 软件简介【15】    10
II.    ANSYS Workbench平台及模块    10
III.    ANSYS Workbench平台及模块    13
IV.    结果与分析    20 MEMS中某硅膜片的热力耦合分析和优化设计:http://www.751com.cn/wuli/lunwen_23647.html