摘要:LED（light emitting diode，发光二极管）光源是一种新型光源，由于具有节能、环保、使用寿命长等优点，正逐渐取代白炽灯、荧光灯等传统照明光源，成为未来照明的发展趋势。随着LED光源亮度越来越高，LED灯具的功率也不断增大。然而目前LED光源的电光转换效率一般只有20%~30%，输入功率大部分转换为热量，在芯片内部集聚，若不能将这些热量及时散发出去，将导致光衰、光通量降低等问题，严重影响LED光源的使用寿命及可靠性。38488
首先，本论文分析了LED球泡灯的散热方式和散热通道，并对主要的散热途径运用热学建模的思想，建立了LED球泡灯的热阻模型，通过对该模型进行分析找到了优化LED球泡灯散热的方向。
其次，通过基于Pro/E的流体力学软件FloEFD建立LED球泡灯各部件的仿真模型，并根据灯珠的种类和排布不同设计了3种15W的LED球泡灯初始模型。
再次，本论文通过对3种LED球泡灯模型进行仿真模拟，通过比较得到的模拟结果，选出一种散热性能最好的LED球泡灯模型进行后续的优化设计。
最后，通过用MCPCB、氮化铝陶瓷基板和几种氧化铝陶瓷基板进行热仿真模拟，对比仿真模拟结果，选择了一种最合理的基板。通过用几种导热系数不同的导热塑料进行热仿真模拟，对比实验得到的LED球泡灯的切面图，选择了一种比较合适的塑料。最后对散热肋片的数目和肋片的厚度进行优化，通过热仿真模拟并比较分析得到的仿真结果，得到最优的肋片数目和肋片厚度。通过上述一系列的优化设计，设计出了一款散热性能较好，成本较低的LED球泡灯。
毕业论文关键词：LED球泡灯；散热；热模拟；优化
 High power LED bulb thermal design and optimization
Abstract：LED light source is a new light source, due to the energy saving, environmental protection, long life and other advantages, is gradually replacing the incandescent, fluorescent and other traditional lighting sources, has become the development trend of the future lighting. With more and more high brightness LED light source, LED lighting power is also increasing. However, there is an electro-optical conversion efficiency of the LED light source is generally only 20% to 30%, most of the input power is converted to heat accumulation in the chip, if the heat can’t dissipate in time, will lead to bad light, luminous flux reduced, which seriously affect LED light source life and reliability.
Firstly, this paper have analyzed the LED bulb heat dissipation and cooling channels，use ideas of thermal modeling, established LED bulb thermal model for the main cooling channels, according to analyze the thermal model, we found optimization direction of LED bulb heat dissipation.
Secondly, we use the fluid dynamics software FloEFD, which base on the software ProE, designed simulation model of each part of LED bulb, and in line with the different lamp beads type and arrangement designed the initial model of three kinds of 15W LED Bulb. Compared with their heat dissipation performance and choose the best model.
Finally, Performed thermal simulation on the MCPCB substrates, aluminum nitride ceramic substrates and several alumina ceramic substrate, choose a reasonable substrate after compared with simulation results. Then we simulate several thermal plastic have different thermal conductivity, compared with cutout of LED bulb, choose the most reasonable thermal plastic. Finally, we have optimized thickness and number of fins. According to thermal simulation, compare and analyse simulation results, get the optimal number and thickness of fins by thermal simulation. Through the above series of optimized design, we devised a better thermal performance, low cost LED bulb.
Key words:  LED bulb; heat dissipation; thermal simulation; optimize
 目  录 大功率LED球泡灯散热设计与优化:http://www.751com.cn/wuli/lunwen_37478.html