摘要：本课题采用单因素优化实验法，研究深孔镀镍工艺的各种条件下的深镀能力和镀层厚度均匀分布能力。本实验主要在原有瓦特镀镍基础液的基础上，通过对镀液各成分添加比例、添加剂添加量的研究和对工艺条件的调整优化等试验，研究出了最优的工艺配方，得到的工艺配方是：硫酸镍220g/L，氯化镍50g/L，硼酸40g/L，糖精1g/L，烯丙基磺酸钠4g/L，B1000 2mL/L，电流密度为2A/dm2温度为50。C，pH 4.0~4.5。在该条件下，测定了镀层的深镀能力和镀层厚度均匀分布能力，并研究了镀层的结合力、外观等方面的内容。实验表明，在该工艺下电镀，能够获得外观良好，镀层光亮，结合力良好的镀层，能够满足需求，镀液的深镀能力好，镀层厚度分布均匀。10946
关键词：光亮镀镍；深孔镀镍；深镀能力；添加剂
Study on Nickel Electroplating Technology for Deep-Hole
Abstract：This topic optimized by single factor experiment to study the deep nickel plating under various conditions covering power and uniform coating thickness distribution capabilities. This experiment based on the original Watts nickel plating solution, based on the bath by adding ratio of the components, the amount of additive added and the adjustment and optimization of the process conditions and other tests, the optimal formulation process developed, and the resulting technology formulations are: Nickel sulfate 220g / L, nickel chloride 50g / L, boric acid 40g / L, saccharin 1g / L, allyl sulfonate 4g / L, B1000 2mL / L, the current density is 2A/dm2 temperature of 50。C，pH 4.0 ~ 4.5. In this condition, the measurement of the throwing power of the coating and coating thickness distribution capacity and the binding strength of the coating, and appearance aspects. Experimental results show that under the plating process, a good appearance can be obtained, bright coating, good adhesion of the coating, to meet the demand, good throwing power of the bath, the coating thickness distribution.
KeyWords: Bright nickel plating; Deep-hole nickel-plated; Covering power; Additive.
目录
1引言 1
1.1研究的概况和意 1
1.2研究的目的及内容 1
1.3深孔镀镍工艺国内外研究的情况 1
1.3.1镀镍工艺国外研究情况•1
1.3.2镀镍工艺国内研究情•2
1.3.3深孔镀镍工艺3
1.4研究深孔镀镍工艺达到的目标•4
2技术原理•5
2.1镀镍电沉积机理•5
2.2添加剂的机理与作用5
2.2.1添加剂的使用与作用•5
2.2.2添加剂的作用机理6
3工艺研究方法8
3.1工艺研究方法•8
3.2性能测试与实验方法8
3.2.1溶液性能测定方法• 8
3.2.2镀层性能测定方法9
3.2.2.1镀层外观的测定•9
3.2.2.2镀层厚度均匀分布能力的测定•9
4实验研究•10
4.1实验仪器与试剂10
4.1.1实验材料10
4.1.2主要实验仪器•10
4.1.3主要药品试剂•10
4.2镀层的制备11
4.2.1基础溶液的配制•11
4.2.2添加剂的配比•11
4.2.3电镀11
5实验结果与讨论13
5.1实验结果•13
5.2工艺成分的作用与影响•13
5.2.1硫酸镍的影响•13
5.2.2氯化镍的影响•14
5.2.3硼酸的影响16
5.2.4糖精的影响•17
5.2.5烯丙基磺酸钠的影响18
5.2.6 B1000的影响19
5.3工艺条件的影响20
5.3.1温度的影响20
5.3.2 PH的影响21
5.3.3电流密度的影响•22
6结论24
致谢•25
参考文献•26 深孔镀镍工艺研究+文献综述:http://www.751com.cn/huaxue/lunwen_10192.html