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摘 要 聚酰亚胺( PI )是20世纪60年代初由美国杜邦公司研发的芳杂环高分子材料, 由于其分子内存在刚性的主链结构，具有相当优良的热稳定性、耐热性能、力学性能、介电性能和耐辐射性能等，这使其越来越广泛地应用于航空、航天、电子、机械等领域。近年来，性能优异的聚酰亚胺涂层胶因其优异的性能，广泛的应用范围而受到大家的关注。其具有耐热、耐腐蚀、耐湿以及优良力学和机械性能，对玻璃、单晶体、金属表面等具有优良的粘接性能，可广泛用于微电子工业中，如芯片保护膜、缓冲涂层膜、钝化膜、α粒子遮挡膜及多层金属互联电路的层间绝缘层膜等。 本文采用BTDA、PMDA混合二酐和ODA二胺，通过常规亚胺化制备聚酰亚胺涂层胶。利用红外光谱(FTIR)、热失重分析(TG)、万能电子拉伸机和附着力测试等手段系统研究了二酐比例、制备工艺对胶液涂覆性能的影响及形成胶层的性能。 结果表明：拉伸强度随 BTDA 用量的增加先增大后减小。当 PMDA:BTDA 为40：60 时，聚酰亚胺薄膜拉伸强度达到最大；PI的热分解温度均比较高，均超过 516℃，说明有很好的耐热性。当 BTDA:PMDA=40:60 时，热稳定性最高，PI 的热分解温度高达596.94℃，在599.61℃达到它的最大分解速率，当 BTDA 的比例进一步增大时，PI的热分解温度逐渐降低；随着 PMDA含量的降低，BTDA含量的升高，PI的附着力得到很大的增强，在 BTDA:PMDA=80:20 时，附着力达到最好，为 0 级；经过72h强酸的浸泡腐蚀，PI 薄膜在铝板上的附着力有了较大的下降。对于铝板，PMDA:BTDA=20：80 和25:75 的 PI涂层胶能够保持良好的性能，等级达到了 0 级和一级。当BTDA:PMDA=80：20 时合成的聚酰亚胺最能符合我们的各项性能要求。 59695
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毕业论文关键词：聚酰亚胺; 胶黏剂; 附着力; PI覆铝板
Title Preparation and properties of polyimide coatings
Abstract Polyimide(PI) is a aromatic heterocyclic polymer developed by DuPont in United States in the early 1960 of the 20th century which have the ability of excellent hydrolysis and salt spray resistance. Polyimide materials property features excellent fuel, oils and organic solvents, and high temperature resistant, acid-resistant characters, which is the excellent heat-resistant electric insulating materials. Properties of polyimide materials also has outstanding radiation resistance (neutrons and electrons), and can be used as structural adhesives, bonding metals such as stainless steel, copper, aluminium and alloys, consistent with the micro-electronics industry (printed circuit board), aviation, aerospace, industrial adhesive requirements. In this paper, BTDA, PMDA and ODA diamine mixed anhydride , was prepared by a conventional imidization polyimide coating adhesive.By means of infrared spectroscopy (FTIR), thermal gravimetric analysis (TG), universal electronic tensile testing machine and the adhesion ,the system dianhydride proportion , preparation for glue coating properties and formation layer performance was studied. The results show that: the tensile strength increase with the the amount of BTDA, witch increases first and then decrease. When PMDA:BTDA is 40:60, the tensile strength of polyimide film reaches the maximum; the decomposition temperature of PI were relatively high, more than 516 ℃, which shows good heat resistance. When BTDA:PMDA is 40:60, the highest thermal stability, temperature come up to 596.94 ℃ thermal decomposition of PI, it reached the maximum decomposition rate at 599.61 ℃, when the ratio of BTDA increased when the temperature decreases, the thermal decomposition of PI; with the decrease of PMDA content,the content of BTDA increase, the adhesion of PI is greatly enhanced.when BTDA:PMDA is 80:20,PI achieves the best adhesion, 0; After immersion corrosion 72h of strong adhesion of PI films on aluminum, the strength of adhesion have been greatly decreased. For aluminum, PI in which PMDA:BTDA=20:80 and 25:75 coating adhesive can maintain good performance, grade of 0 and 1. When BTDA:PMDA is 80:20 ,synthesis of polyimide can meet the performance requirements of us.