倒装芯片键合中视觉对准系统设计

[摘要]：随着科学技术的发展，电子产品越来越深入到千家万户。由于芯片与基板焊接的重要过程就是对准，只有光路对准，才能进行完美焊接。光路对准又涉及到图像配准的的难题，本文的主要任务就是在一个简单的光路系统中，设计出一个能满足要求的匹配系统。这里所说的匹配不是那种简单的单凭肉眼所能完成的，也要借助于一些仪器。因为面对这种大批量的倒装键合，凭人的效率太过低下，也满足不了实际需要。我们会在论文里设计一个智能算法，这个智能算法的设计过程是先进行边缘检测，下面是特征提取，再紧接着就是图像匹配。还有现在的微电子封装中，对倒装芯片的要求越来越高，对倒装键合的要求也越来越高。因为倒装芯片键合存在着一些他自然的优势，所以它的用途会越来越广，那么研究它就显得格外重要。实验证明，本系统精度尚能满足要求，为本课题的进一步研究提供了便利。37882
[毕业论文关键词]：倒装芯片键合对准系统智能算法
目录
摘要 I
Abstract.II
第 1 章前言..1
1.1课题背景..1
1.2微电子封装的技术要求..1
1.3微电子封装的关键技术..2
1.4倒装芯片..2
1.4.1倒装芯片概念.2
1.4.2倒装芯片原理.2
1.4.3倒装芯片的发展3
1.5数字图像处理的应用领域.3
1.6本论文的课题来源、研究作用及文章内容安排.4
1.6.1课题来源4
1.6.2课题的研究作用5
1.6.3论文的内容安排5
第 2 章光路系统设计6
第 3 章数字图像处理9
3.1数字图像的概念..9
3.2数字图像处理9
3.3数字图像处理的常用方法.9
3.4数字图像处理的应用工具..10
3.5数字图像处理的基本特点..10
3.6数字图像处理的主要优点..10
3.7图像的预处理.11
3.7.1灰度直方图11
3.7.2二值化处理11
3.7.2.1 等值二值化 12
3.7.2.2 OTSU 二值化 12
3.7.2.3 熵算法二值化.. 12
第 4 章图像匹配与算法设计..14
4.1图像匹配14
4.1.1图像匹配的概念.14
4.1.2图像匹配的流程.14
4.1.3图像匹配的分类.15
4.1.3.1 以灰度为基础的匹配.. 15
4.1.3.2 以几何特征为基础的图像匹配. 15
4.1.4 灰度法和几何特征匹配算法的比较 16
4.2算法设计17
4.2.1基于不变矩的图像匹配.19
4.2.2像素级有向点的提取与描述..20
4.2.3有向点的相似性度量..21
4.3匹配实验23
第 5 章总结24
后记.25
附录.26
参考文献..29
Design of visual alignment system for flip chip bonding[Abstract]：With the development of science and technology, electronic products becomemore and more deeply into the thousands of households. As an important process of thechip and the substrate welding is alignment, only optical alignment, in order to perfectwelding. Optical alignment, and relates to the image registration problem, the main task ofthis paper is in a simple optical system design can meet the requirements of the matchingsystem. Here, not the kind of simple naked eye alone can be completed, but also to helpsome of the instruments. Because in the face of this large quantities of flip chip bondingand, with the efficiency is too low, can not meet the actual needs. We will design anintelligent algorithm in the paper, the design process of the intelligent algorithm is todetect the edge first, the following is feature extraction, and then followed by is imagematching. There are now in microelectronic packaging, the flip chip of the increasinglyhigh demand, the flip chip bonding and the requirements of increasingly high. For flipchip bonding and there are some his natural advantages, so its use will more and morewidely, so it is particularly important.Experiments show that, the precision of system can meet the requirements, provideconvenience for the further research of this topic.[KeyWords]: Flip chip Bonding Alignment system Intelligent algorithm 倒装芯片键合中视觉对准系统设计:http://www.751com.cn/zidonghua/lunwen_36748.html