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    Title  Preparation and Performance of Colorless,Transparent Polyimide film Abstract     Dianhydride 9FDA and diamine 2,2'-bis-trifluoromethyl -4,4'-diamino-diphenylether(TFODA) were adopted to prepare a colorless, transparent fluorinated polyimide (PI) film by two-step in N,N'-dimethylacetamide (DMAC).After the analysis of tensile strength, TG and Ultraviolet-visible spectrum, it is found that tensile strength of the resultant film reaches 85.0Mpa,T5% is larger than 530°C, T10% is over 550°C, cut-off wavelength is 330nm and transmission is up to 96.0%, which showed excellent comprehensive performance. We also investigated the influence of different content of 3,3’,4,4’-ODPA (n(9FDA):n(ODPA)= 9:1,8:2,7:3, 6:4,5:5 and 4:6 respectively ) on the mechanical property, thermal property and optical property compared with 9FDA- TFODA- PI. Results showed that the mechanical property and thermal property of PI films can be improved by adding ODPA, but the optical property and adhesion performance reduced. The incorporation of trifluoromethyl group into PI molecular chain  can also decrease the adhesion performance of PI film with other materials significantly. By introducing silicon-containing diamine α-ω-diaminopropyl polysiloxanes (PMDS) into the molecular chain, we explored the effect of different silicon-containing diamine content (n(TFODA):n(PMDS)=95:5,90:10,85:15,80:20) on  its various properties of PI film, especially on adhesion performance. It was found that when n(TFODA):n(PMDS)=90:10, adhesive force on glass plate of PI can achieve grade 2, boiling time is over 24 hours, tensile strength is 79.1Mpa,T5%=498℃, T10%=542℃, cut-off wavelength is 338nm and transmission is up to 93.7%, which presents excellent comprehensive performance.26053
    Keywords  polyimide film; colorless and transparent; adhesive force.
    Catalog
    1 Introduction    1
      1.1 Foreword    1
      1.2 Overview of traditional polyimide     2
         1.2.1 The development process of polyimide    2
         1.2.2 The performance and application of polyimide    3
      1.3 Overview of fluorinated polyimide    4
      1.4 Overview of silicon containing polyimide    5
      1.5 Colorless polyimide molecular design    5
         1.5.1 Trifluoromethyl group introduced in PI chain    6
         1.5.2 Introducing alicyclic structure in the main chain of PI    6
         1.5.3 The introduction of large side groups in the PI chain    7
         1.5.4 Other molecular design methods    8
      1.6 Research objectives and content of this project    9
    2 Preparation and Properties 9FDA-ODPA-TFODA- PI film    10
      2.1 Experimental materials and equipment    10
         2.1.1 Experimental materials    11
         2.1.2 Experimental equipment    10
      2.2 Experimental content    11
         2.2.1 Drying of materials and equipment    11
         2.2.2 Synthesis of PAA    11
         2.2.3 Preparation of PI film by thermal imidization    12
      2.3 Performance Testing    12
         2.3.1 PI film mechanical property     12
         2.3.2 PI film thermal performance test    12
         2.3.3 PI film optical performance test    13
         2.3.4 PI film adhesion test    13
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