压电厚膜微型芯片的研究+文献综述

摘要由于声表面波器件具有小型化、多功能、高频率、高可靠性和数字输出等特性，目前已被广泛应用于移动通信、航空航天、雷达、电子对抗、遥控遥测、广播电视等各类军用和民用电子系统中。因其应用潜力巨大、发展前景广阔，故对声表面波器件的研究具有重大的意义。本文根据0.98PZT-0.02SNN压电陶瓷材料制备出了压电厚膜，并且在压电厚膜的基础上成功制备了声表面波器件(SAW)。33130
    首先，利用传统的固相烧结法制备了压电陶瓷片，并对其性能进行检测，得到符合制备声表面波器件(SAW)的陶瓷，其具体的参数分别为：d33=430pC/N、kp=0.70、εr=2126、Qm=163.98、tanδ=0.014、TC=360℃。
    其次，用先烧陶瓷柱后切割再抛光的方法制备厚度为100µm、表面平整的压电陶瓷厚膜。
    最后，根据设计好的叉指电极的尺寸参数，采用光刻的方法成功制备出了接近10µm线宽的叉指电极，得到了声表面波器件(SAW)。
关键词声表面波(SAW)器件压电厚膜叉指电极
毕业论文设计说明书外文摘要
Title   The study of piezoelectric thick films microchips
Abstract
Surface acoustic wave device has some characteristics, such as miniaturization、multifunction、high frequency、high reliability、digital output and so on. So surface acoustic wave device is widely used in many kinds of electronic systems of military and civil, such as mobile communications、aviation and spaceflight、radar、 electronic counterwork、telecontrol and telemetry、television and so on. Surface acoustic wave device has great potential in application and wider foreground in development, so it is significative to investigate surface acoustic wave device. In this paper, the piezoelectric thick film was prepared according to the 0.98PZT-0.02SNN piezoelectric ceramic material, and the saw device (SAW) was successfully fabricated on the basis of the piezoelectric thick film.
Firstly, using conventional solid-state sintering method to preparing piezoelectric ceramic pieces, and piezoelectric properties were comparably studied. The result showed that the ceramic is suit for saw device. The properties are: d33=430pC/N、kp=0.70、εr=2126、Qm=163.98、tanδ=0.014、TC=360℃。
Secondly, we sintered the ceramic column and then cutting and polishing it. After that we get the piezoelectric thick film. The thickness of film is 100 µm and the surface of film is very smooth.
Finally, according to the size of interdigital electrode which have already designed, we successfully get the interdigital electrode. The width of finger was nearly 10μm and we get the saw device.
Keywords Surface acoustic wave device   Piezoelectric thick film   Interdigital electrode
目   次
1 绪论   1
1.1   压电厚膜   1
1.1.1 压电效应   1
1.1.2 压电材料的主要参数   1
1.1.3 压电厚膜的应用   3
1.2   锆钛酸铅系陶瓷   3
1.3 声表面波器件概述   5
1.3.1背景介绍   5
1.3.2 声表面波器件的工作原理   5
1.3.3 声表面波器件的发展现状   7
2 声表面波器件的制备   9
2.1 固相烧结法制备0.98PZT-0.02SNN压电陶瓷   9
2.2陶瓷柱切割形成薄片   12
2.3压电薄片表面抛光   12
2.4光刻叉指换能器   12
3压电陶瓷及其微型芯片的性能   15
3.1 0.98PZT-0.02SNN压电陶瓷性能   15 压电厚膜微型芯片的研究+文献综述:http://www.751com.cn/cailiao/lunwen_30045.html